XPand6000

Extreme Engineering Solutions

Download:

XPand6000-DS.pdf

Description:

The XPand6000 natural convection-cooled, fully-ruggedized ATR chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space efficient off-the-shelf rugged technology. In today's avionics and ruggedized environments, size really does matter, and the XPand6000 sets a new standard for rugged small form factor computing systems.

The XPand6000 supports an internal carrier card that can be populated with a high-performance ruggedized COM Express module designed and manufactured by X-ES or a third party. The XPand6000 carrier card supports a PMC or XMC module, an SSD, and can also be customized to support application specific circuitry such as additional I/O or an FPGA. X-ES has an extensive lineup of PMC or XMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party ruggedized COM Express or PMC/XMC modules.

An optional 1.8 in. or Slim SATA SSD memory module (with optional integrated encryption) provides the convenience of high capacity off the shelf storage, the ruggedness of solid-state non-volatile memory, and the security of 256-bit AES encryption. X-ES maximizes power supply performance per cubic inch, supporting an integrated MIL-STD-704 28V DC power supply and MIL-STD-461 EMI filtering. Internal hold-up can be provided, as well.

Please contact X-ES sales to begin designing a system that will meet or exceed your I/O, processing, and power requirements.

Categories:

Com Express® > (Com Express) Systems