Express-IBR

ADLINK Technology Inc.

Contact:

Elsie Chen
Product marketing

Download:

Express-IBR_Datasheet_20140505.pdf

Description:

Extreme Rugged COM Express® Type 6 Computer-on-Module with 3rd Generation Intel® Core Processor and QM77 Chipset

Features
- Quad/dual core 3rd Generation Intel® Core Processor with Mobile Intel® QM77 Express Chipset
- Up to 16GB ECC 1600MHz DDR3 memory in two SODIMM sockets
- Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
- Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1)
Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, USB 2.0, 4 USB 3.0
- 50% Thicker PCB for high vibration environments

Categories:

Com Express® > (Com Express) Sizes > (Com Express - Size) Basic