XPand6000 Series


Extreme Engineering Solutions

Benjamin Klam
VP of Engineering
XPand6000 Series systems are based on convection-cooled and conduction-cooled, fully-ruggedized Small Form Factor (SFF) chassis designed and tested to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space-efficient COTS technology. Its small size, availability in horizontal and vertical orientations, and use of COTS components enables the XPand6000 Series to be deployed quickly into a wide variety of airborne and ground vehicle applications.

XPand6000 Series systems support an internal carrier card that can be populated with a high-performance ruggedized Freescale QorIQ or Intel® Core i7 processor-based COM Express module, a PMC or XMC module, an SSD, and it can be customized to support application-specific circuitry such as additional I/O or an FPGA. X-ES has an extensive lineup of PMC and XMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party ruggedized COM Express or PMC/XMC modules.

An optional Slim SATA SSD memory module (with optional integrated encryption) provides the convenience of high-capacity off-the-shelf storage, the ruggedness of solid-state non-volatile memory, and the security of 256-bit AES encryption. X-ES maximizes power supply performance per cubic inch, supporting an integrated MIL-STD-704 28 VDC power supply and MIL-STD-461 EMI filtering. Internal holdup can be provided, as well.
Com Express® Com Express® > (Com Express) Systems